Bondascope 3100

Dependable and Versatile Bond Tester for Aerospace Applications

The Bondascope 3100 handheld bond tester is used throughout the aerospace industry. Both military and commercial customers rely on the Bondascope 3100 daily for manufacturing and in-service inspections. By utilizing low and high frequencies, it easily evaluates the most difficult composite test objects. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the Bondascope offers an easy-to-use use-operator interface, data archiving, and presets for the most common applications.

The Bondascope 3100 operates with three different testing modes to cover a range of applications, utilizing Pitch-catch, Mechanical Impedance Analysis (MIA), and Resonance modes for evaluation of composite and laminated test samples. This handheld instrument is a valuable tool for the evaluation of first article material testing. Thanks to the instrument’s automatic probe recognition capability and alarm modes, operators can focus on the collection of the data without the fear of missing discontinuities or defects.

All other manufacturers’ probes may be used in conjunction with the Bondascope 3100. The standard package includes the instrument, Pelican style case, manual, battery, and AC charger. The Bondascope 3100 may be integrated into the Bond Hub II, the only portable Bond Testing C-Scan solution on the market for the price.

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  • Standard package includes instrument, Pelican style shipping case, manual, battery and AC charger
  • Resonance, Pitch-catch and Mechanical Impedance modes
  • Auto-probe recognition and probe library
  • RF Impedance plane display mode
  • Time encoded bond profile display mode
  • Reference display mode
  • Alarm modes: Amplitude, Phase. Halo, square, ellipse ring gates
  • High speed swept frequency
  • Individually sizable ‘ring’ gates with alarms
  • Compatible with probes from other manufacturers
  • Splitscan and Splitview


ModesResonance (RF & flying dot); pitch catch (tone burst – adjustable frequency, cycles and altitude) high energy pulsed mode, swept frequency; mechanical impedance analysis (MIA) fixed and swept frequency
Display240 x 320 pixels, quarter-VGA, 5.7″(14.4mm) diagonal high-bright EL
Probe connectorstandard 11-pin Fischer & 8-pin Lemo
Frequency range250Hz-1.5MHz probe and setup specific
Operating temperature15 F to 105 F (-10 C to +40 C)
Alarmsbox, polar and up to 8 individual and individually sizeable “ring gates” centered at stored reference dot locations in impedance plane operation. Positive or negative operation
Storage100 setups and 250 screens with real-time date and time stamp
Dimensions9.25″H x 5.5″W x 2.9″D (235x140x74mm)
Weight5-lb (2.26kg) including battery


  • Multi-layered laminates
  • Skin to core flaws
  • Glass fiber/ carbon fiber composites
  • Far-side defects
  • Honeycomb and foam cores
  • Impact damage
  • Metal to metal bonding
  • Adhesively bonded fittings
  • Liquid Ingress


  • Resonance Probes
  • MIA Probes
  • Pitch-Catch Probes
  • Protective carry case
  • Battery external charger and conditioning unit




Download Bondascope 3100 Brochure

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