Dependable and Versatile Bond Tester for Aerospace Applications
The Bondascope 3100 handheld bond tester is used throughout the aerospace industry. Both military and commercial customers rely on the Bondascope 3100 daily for manufacturing and in-service inspections. By utilizing low and high frequencies, the Bondascope 3100 easily evaluates the most difficult composite test objects. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the Bondascope 3100 offers an easy-to use-operator interface, data archiving, and presets for the most common applications.
The Bondascope 3100 operates with three different testing modes to cover a range of applications, utilizing Pitch-catch, Mechanical Impedance Analysis (MIA), and Resonance modes for evaluation of composite and laminated test samples. This handheld instrument is a valuable tool for the evaluation of first article material testing. Thanks to the instrument’s automatic probe recognition capability and alarm modes, operators can focus on the collection of the data without the fear of missing discontinuities or defects.
All other manufacturers’ probes may be used in conjunction with the Bondascope 3100. The Bondascope 3100 standard package includes the instrument, Pelican style case, manual, battery, and AC charger. The Bondascope 3100 may be integrated into the Bond Hub II, the only portable Bond Testing C-Scan solution on the market for the price.