The Bondascope 300 is a miniature ultrasonic bond tester that operates in an auto-select/manually adjustable tone burst or fixed, high-energy pulsed pitch-catch mode, and offers ultimate ease of use and high-performance composite inspection. This handheld bond tester has the ability to scan a surface and map the bond profile and can store over 250 full scan sets and 100 set ups for the user’s inspection notes.
Innovated with advanced features and portable capability, the Bondascope 300 is also built with a high-speed profile, fully sunlight-readable feature and backlight display which offer a full quarter VGA resolution for higher level of analog interpretation of composite skin, honeycomb metal, metal skin and more.
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