Bond Testers
NDT Systems provides the most capable bond testers on the market for composite inspection of sandwich construction, laminates, multi-layered bonded structures, adhesively bonded fittings, highly attenuating materials, and any construction that needs a high penetrating power. Bond testing C-scan imaging capability can be achieved with our BondHub system.
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Bondascope 3100
Handheld Bond Tester
- Pitch-catch, Mechanical Impedance (MIA) and Resonance Modes
- Programmable User Setups
- Automatic Probe Recognition
- Alarm Modes, Impedance Plane
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BondHub II
Imaging Bond Tester
- C-scan Images in Resonance, Pitch-Catch and MIA Modes
- Compatibility with all our Scanners and the Bondascope 3100, as well as Bond Testers from other Manufacturers
- Portable, Battery Operated, Extensive Image Analysis
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Curlin Air
Air-Coupled Ultrasonic Flaw Detector
- Non-contact, No Surface Preparation
- Remarkable Penetrating Power
- Alarm Modes
- Programmable User Setups