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BondHub II

  • Imaging Bond Tester
  • C-scan images in Resonance, Pitch-Catch and MIA modes
  • Compatible with all our scanners
  • Compatible with Bondascope 3100
  • Portable, battery operated, extensive image analysis
  • Works with bond testers from other manufacturers
Physical / Case Weight 25lb (11kg)
  Dimensions (W x H x D) 7.5in. x 18.0in. x 14.0in. (191mm x 457mm x 356mm)
  Operating Temperature 15 °F to 158 °F (-10 °C to 70 °C)
  Case Construction Integrated in Pelican Style case, vibration isolation
  Connector type USB, DVI, Multi-pin scanner connector
PC Processor 1GHz
  HDD 128GB Solid state
  Operating System Windows 7
  Peripherals Mini-keyboard with trackpad and separate mouse
  Display type Color TFT LCD sun readable 1200nit
  Display size 800 x 600 pixels, 12.1in. (307mm) diagonal
Operational Modes Resonance
    MIA (Mechanical Impedance Analysis)
  Freq range 250Hz to 1.5MHz
  Display Modes C-scan- Phase, Magnitude or Additive view
    Impedance plane (flying dot)= direct representation of bond tester screen
    Strip chart- rectangular real-time streaming of outputs
  Display Analysis Retrace position of all dots acquired
    Flaw sizing- length, area
    Changeable gates in post-processing, Save scan plans, user setups etc.
    Auto and user defined scaling, mm/inch units, move scanner to position
  Image Output format BMP
  Gates/ Alarms Box, ring, sectorial individually sizable gates. LED and audible alarms
Power Source Power Source Two Li-Ion batteries or AC charger (110-240V)
  Battery life 4-5 hours
Certification Certification Factory Calibration
Warranty Warranty 1 year
Compatibility Bond Testers Bondascope 3100
    Other Manufacturer's bond testers
  Scanners Manual Scanners: StringScan, SlideScan
    Automatic Scanners: CrosScan, TunnelScan
  • Standard package includes BondHub integrated in Pelican style case, batteries, AC charger (110-240V), user manual. Windows 7, 1GHz processor, 128GB solid state HDD, CompVu software, keyboard, mouse, 12” sunreadable display*
  • C-scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance (MIA) mode
  • No couplant required for Pitch-Catch and MIA modes
  • Connects directly to Bondascope 3100 and manual or automatic scanners
  • Image Analysis, defect sizing, multiple gates, reporting
  • Portable, battery operated system, large sunreadable screen
  • Compatible with bond testers from other manufacturers

* Bondascope 3100, probes, probe cables and scanners not included

  • Resonance Probes
  • MIA Probes
  • Pitch-Catch Probes
  • Protective carry case
  • Manual and Automatic Scanners
  • Integrity of composites and adhesively bonded structures
  • Multi-layered laminates, glass fiber/ carbon fiber composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings
  • Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more
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