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BondaScope Series, Ultrasonic BondTesters... ALL NEW
NDT Systems, Inc. Since its inception as NDT Instruments in 1971, NDT Systems, Inc. has been widely-recognized as a leading innovator and manufacturer of many types of nondestructive testing instrumentation. Included has been a strong inventive background in ultrasonic bond testers with initial model 210 BondTester, followed by the renowned and still highly used BondaScope 2100 and more recently, Curlin Air, Airborne BondTester. And now, NDT Systems proudly introduces a truly major advance in the bond tester industry: the BondaScope Handheld Composite Bond Tester Series.
BondaScope Series For the first time, a user can now select the feature level of composite bond tester best suited for specific application(s) and budgets. No longer is it necessary to purchase very expensive and complex bond testers, when, very frequently, a much less expensive, less complex version would suffice. Now, a user can wisely choose from three carefully-positioned models in the BondaScope Series: the entry-level, Single-Mode BondaScope 300, the Dual-Mode BondaScope 350 or the Full-Capability Multi-Mode BondaScope 3100.
BondaScope 300 The BondaScope 300 is the entry-level, lowest priced bond tester suited to applications where the Pitch-Catch mode is appropriate. It is an excellent choice for applications where the more advanced features of the BondaScope 350 or 3100 are not necessary. Features include Bond Profile Display, SplitScreen , Example applications include skin-to-core bonds, impact damage and more. BondaScope 350 The BondaScope 350 is a Dual-Mode, mid-priced, handheld bond tester intended for the numerous applications where either Pitch-Catch or Resonance test modes are necessary. Including features such as Bond Profile Display, alarm box, individually sizable halo gates, digital persistence and more, the BondaScope 350 offers exceptional versatility and performance for a surprisingly low price. BondaScope 3100 The BondaScope 3100 represents the ultimate choice for true state-of-the-art performance and versatility given today's ever growing and sophisticated bonded components. It was designed, without exception to be the finest handheld bond tester available at any price. The 3100 offers highly-advanced, simple to use implementations if all three traditional test modes (Pitch-Catch, Resonance and MIA) along with a large host of other features. It is suitable for a multitude of applications, including many of the most challenging in industry – AND, at an incredibly affordable price.
Pricing Breakthrough One of the major goals for the Handheld BondaScope Series was to LITERALLY SHATTER the historically high price barrier associated with bond testers currently available without sacrifice to performance. This goal has been successfully met primarily through the use of modern, cutting-edge microchips incorporated in a Proprietary Platform Design Implementation. Users can now select from a simple-to-operate to highly sophisticated, high-performance bond tester for an incredibly low price.
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