NDT Systems, Inc: BondaScope 3100 - Ultrasonic Bond Tester

Welcome to NDT Systems where more than our web site has changed!!

NDT Systems, Inc. is proud to announce the release of the long awaited BondaScope 3100, Full Multi-Mode, Ultrasonic Bond Tester.

The All New BondaScope 3100 Composite Bond Tester is the latest in a full series of Affordable, Feature Rich, and High Performance Ultrasonic Bond Testers available from NDT Systems, Inc., the originators of the first Microprocessor Based, Impedance Plane Resonance Bond Tester.

The BondaScope 3100 Bond Tester is well suited to inspecting metallic, nonmetallic and combination metallic-nonmetallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bondline thickness variations and certain material properties. Inspectable configurations include adhesivly-bonded laminates, advanced fiber composites and honeycombs. Some typical applications include:

Multi-Layered Laminates

Graphite-Resin Composites

Boron Fiber Composites

Kevlar Composites

Glass Fiber Composites

Composite-to-Substrate

Composite-to-Composite

Honeycomb Structures

Skin-to-Honeycomb

Honeycomb-to-Honeycomb

Impact Damage

Rub Strip

New, Industry Leading Features of the BondaScope 3100 include Bond Profile Mode, Split Screen, High Energy - Pulsed Pitch-Catch Mode, Unique Sweeping Mechanical Impedance Analysis Mode (SweepMI), Separate Phase and Amplitude Alarm Ability, Xor Digital Phosphor EL Display Mode, True User Adjustable Display Persistence and Much More.

Bond Profile is a time encoded (with positonal encoding optional) scanning presentation whereby the Phase/Amplitude are plotted in Real Time presenting a historic trend pattern allowing the user to asses the pattern over time. People generally find trended information is far easier to comprehend and therefore have a much higher confidence level in the inspection. NDT Systems, Inc. was first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester.

Applications include the inspection of metalic, non-metalic and combination metalic/non-metalic structures for a variety of anomolous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fibre damage, core damage, bondline thickness variations, and certian material properties. Inspectable configurations include adhesivly-bonded laminates, advanced fiber composites and honeycomb to mention a few. Some typical applications include multi-layer laminates, graphite resin composites, boron fiber composites, Kevlar composites, glass fiber composites, composite-to-substrate, composite-to-composite, honeycomb structures, skin-to honeycomb, honeycomb-to honeycomb and many more.


	The patented, Industry Leader of the time, BondaScope 2100 is still supported (who says that today) and in use by major manufacturers in Aeorspace today who claim it is STILL the most "Sensitive" unit available today. NDT Systems has of course have met and improved on its performance.




Circa 1977


	*Examples of a few unique Operational Modes*




	Impedance Plane with Air Dot




		Sweeping MIA Mode



	RF with Bond Profile in SplitScan




	Phase, Amplitude, X & Y "Live" Reference Curves




	Pitch Catch RF Mode


	*BondaScope 3100 - Ultrasonic Bond Tester -Specifications:*

Modes: Resonance (RF & Flying Dot); Pitch Catch (Tone Burst - Adjustable Frequency, Cycles and Amplitude) High Energy Pulsed Mode. Swept Frequency; Mechanical Impedance Analysis (MIA) Fixed and Swept Frequency... Industry First.

Display: 240x320 QVGA, 5.7" Diag High Bright EL

Probe Connector: Standard 11 Pin Fischer - Adapts to other available probes.

Frequency Range: 250 - 1.5MHz Probe and setup specific

Alarm: Box, Polar and up to 8 individual and individually sizable "Ring Gates" centered at stored Reference Dot locations in Impedance Plane operation. Positive or negative operation.

Storage: 100 Setups & 250 Screens w/ Real Time Date and Time Stamp. Full 32 character Alpha-Numeric File naming with 8 lines of 32 characters for user comment or instruction.

Master Supervisor Setup and Lockout: Supervisory mode allows individual instrument setups parameters to be totally locked, totally unlocked or allow the user to operate ONLY within the supervisory defined parameters. For instance, allow frequency change within 24-28KHz and Gain within 35-40dB and no change to alarm etc. Available to EVERY instrument setup parameter! Industry First

Inputs & Outputs: 0-5VDC - Alarm - Positive or Negative - Latched or Momentary, Phase, Amplitude, X and Y Dot Location - Rate continuous in Resonance and Mechanical Impedance, USB

Power: Single Li-Ion High Energy Battery Smart Cell. In Battery Microprocessor reports current charge and time to empty - Approx 8 Full Hours Operation

Conditioning Fast Charger provides extended battery life and charge condition calibration. 85-240VAC Auto Sensing

Dimensions: 9.25H x 5.5W x 2.9D - Weight - 5Lbs

Operating Temperature: -10° to 140°F

Accessories and Options Include:
Full Range of Resonance, Pitch Catch
and MIA probes and Cables, Pellican
Style transport case,
Instrument Soft Pouch,
Spare Batteries, Bond
Profile Encoding Cart,
Data Storage and Transfer
Software - Windows Based.

Contact Us regarding Probe Fixtures and Custom Application Requirements.

Applications include: AL Laminates, Composites, Honeycomb and more

Probe Samples
MIA, Pitch-Catch & Resonance


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	*NDT Systems, Inc.* 17811 Georgetown Lane, Huntington Beach, CA. 92647 Phone (714) -893-2438 * Fax (714) -897-3840 Contact info@ndtsystems.com with questions or comments on NDT Systems products. Contact webmaster@ndtsystems.com with questions or comments regarding this web site Copyright 2001 - 2007 NDT Systems, Inc. All rights reserved.