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NDT Systems, Inc. is proud to announce the release of the long awaited BondaScope 3100, Full Multi-Mode, Ultrasonic Bond Tester.
The All New BondaScope 3100 is the latest in a full series of Affordable, Feature Rich, and High Performance Ultrasonic Bond Testers available from NDT Systems, Inc., the originators of the first Microprocessor Based, Impedance Plane Resonance Bond Tester.
The BondaScope 350 is well suited to inspecting metallic, nonmetallic and combination metallic-nonmetallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bondline thickness variations and certain material properties. Inspectable configurations include adhesivly-bonded laminates, advanced fiber composites and honeycombs. Some typical applications include:
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Multi-Layered Laminates
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Graphite-Resin Composites
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Boron Fiber Composites
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Kevlar Composites
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Glass Fiber Composites
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Composite-to-Substrate
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Composite-to-Composite
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Honeycomb Structures
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Skin-to-Honeycomb
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Honeycomb-to-Honeycomb
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Impact Damage
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Rub Strip
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New, Industry Leading Features of the BondaScope 3100 include Bond Profile Mode, Split Screen, High Energy - Pulsed Pitch-Catch Mode, Unique Sweeping Mechanical Impedance Analysis Mode (SweepMI), Separate Phase and Amplitude Alarm Ability, Xor Digital Phosphor EL Display Mode, True User Adjustable Display Persistence and Much More.
Bond Profile is a time encoded (with positonal encoding optional) scanning presentation whereby the Phase/Amplitude are plotted in Real Time presenting a historic trend pattern allowing the user to asses the pattern over time. People generally find trended information is far easier to comprehend and therefore have a much higher confidence level in the inspection. NDT Systems, Inc. was first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester.
Applications include the inspection of metalic, non-metalic and combination metalic/non-metalic structures for a variety of anomolous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fibre damage, core damage, bondline thickness variations, and certian material properties. Inspectable configurations include adhesivly-bonded laminates, advanced fiber composites and honeycomb to mention a few. Some typical applications include multi-layer laminates, graphite resin composites, boron fiber composites, Kevlar composites, glass fiber composites, composite-to-substrate, composite-to-composite, honeycomb structures, skin-to honeycomb, honeycomb-to honeycomb and many more. |